EngD on development of broadband electrical driver amplifiers for modulators

Eindhoven University of Technology
March 10, 2024
Offerd Salary:Negotiation
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EngD on development of broadband electrical driver amplifiers for modulators


Engineering Doctorate (EngD)

Irène Curie Fellowship



Electrical Engineering



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Job description

EngD Program at TU/e

The post-master designer program is a prestigious two-year salaried program in the field of technological design, leading to an Engineering Doctorate (EngD) degree. It develops the trainee's capabilities to work within a professional engineering context, in an application- and system-design- oriented setting.

For more information, please check https: // www. tue.nl/en/education/graduate- school/engd-at-tue/

Description of the HiCONNECTS project

The project is a large consortium of companies, academics, and research institutes that are trying to address heterogeneous integration for connectivity and sustainability (HiCONNECTS). The high-level objective of HiCONNECTS is to support major societal and industrial challenges by developing heterogeneous integration (HI) technology solutions for energy- efficient and high-performance wireless/wired cloud and edge computing as well as automotive radar. The aim is to solve two of the main challenges: the transmission of Internet of Things (IoT) data over the IT network and the sensing of objects to enable Highly Automated Driving (HAD).

The high latency, limited bandwidth, and high energy consumption per bit of current wireless/cloud platforms cannot satisfy IoT applications. Furthermore, the current radars are not sufficient for Level 4 and 5 HAD. The objective of this project is to use the HI components to develop solutions in societal and economically important areas, with a major focus on RF technologies (Wi-Fi, 5G/6G, and radar) and IT data growth infrastructure (networking cards and switches) for the advancement of sectors such as connected vehicles, smart cities, and connected industry.

HiCONNECTS' s scope includes the design and manufacturing of high-performance Radio Frequency (RF) as well as energy-efficient cloud and edge Information Technology (IT) components and systems in addition to manufacturing technology enhancements. HiCONNECTS' s scope includes also 'Heterogeneous integration' pilot lines at multiple partners; manufacturing partners; key automotive applications demonstrators in Europe, public safety, and life science and health industries, where efficient high-speed transmission of data is essential and is relevant for society and the economic growth.

Tasks for the EngD in the project

Ferdinand Braun Institute (FBH) with academia, equipment manufacturer, IC, and packaging manufacturers is leading a pilot line that integrates high-speed electronics and photonics with broadband interconnect technology into a seamless module using heterogeneous integration (HI) technologies. The focus of this pilot line lies on high-speed wide bandwidth electronics development. The foreseen data throughput, as described above, necessitates instantaneous bandwidths well beyond 100 GHz. Direct modulated laser and modulator photonic chips are flip-chips mounted to electronic driver amplifiers forming high data rate optoelectronic transmitting components. In addition, TU/e will develop broadband SiGe BiCMOS driver amplifiers with beyond 100 GHz bandwidth connecting to the MZM modulators in InP technology. TU/e will employ a SiGe BiCMOS electronics technology, and this will pave the way to the hetero- integration of InP electronic and photonic components. This HI approach will be followed beyond HiCONNECTS activities.

The electrical driver in an optical communication system provides sufficient current/voltage signal for the optical modulator. This project will develop on the work carried out in the H2020 WIPE project on the development of wide- bandwidth BiCMOS drivers for optical communication systems. This project would explore the development of 200 GHz bandwidth drivers in a SiGe BiCMOS technology. As a part of this development, several driver topologies will be considered and an improved design methodology will be implemented to enable wide bandwidth and low group-delay variation (less than 10 %) in the electronic driver.

Furthermore, this project will consider the co-design of the electronic driver and the optical modulator. This co-design will be a step towards the integration of BiCMOS electronics and InP photonics. This project would involve a re-think of the driver-modulator system and will explore several system-level designs to enable the co-integration. This task will be in synchronization with the electronic driver design. As a part of this co- integration, 3D packaging technology, such as flip-chip or through-polymer vias will be considered to enable the integration of BiCMOS and InP dies.

Job requirements

Applicants must have or expect to receive a Master of Science degree or equivalent in Electrical Engineering. The selection of candidates is based on advanced-level courses, thesis work, and the interview process. During the interview process, emphasis will be placed on not just the educational qualifications but also the ability for creative thinking, teamwork competencies, and personal motivation. Although not mandatory, experience in the field of microelectronics design, electromagnetics, and design tools such as MATLAB and ADS-Momentum will be advantageous.

Conditions of employment
  • A meaningful job in a dynamic and ambitious university.
  • To support you during your EngD and to prepare you for the rest of your career, you will make a Training and Supervision plan, and you will have free access to a personal development program for PhD students (PROOF program).
  • A gross monthly salary and benefits (such as a pension scheme, pregnancy, maternity leave, and partially paid parental leave) in accordance with the Collective Labor Agreement for Dutch Universities.
  • Additionally, an annual holiday allowance of 8% of the yearly salary, plus a year-end allowance of 8.3% of the annual salary.
  • Should you come from abroad and comply with certain conditions, you can make use of the so-called ‘30% facility', which permits you not to pay tax on 30% of your salary.
  • A broad package of fringe benefits, including an excellent technical infrastructure, moving expenses, and savings schemes.
  • Family-friendly initiatives are in place, such as an international spouse program, and excellent on-campus children's daycare and sports facilities.
  • Information and application

    Information and application

    Eindhoven University of Technology (TU/e) is a research university specializing in engineering science and technology. Some of the expertise and activities within the Electrical Engineering (EE) department of the University include optical signal generation, transmission, hybrid wireless- optical communication systems for millimeter wave and low-Terahertz applications, broadband energy-efficient optical transceivers for datacoms and monolithic or heterogeneous electronic photonic integration. As a part of this project, you will be a part of the Integrated Circuits (IC) group in the EE department at TU/e. As a part of the IC group, you will be a part of a group of experts for THz electronics design and the student will have access to support and laboratory facilities in the group.

    If you think you are a good fit for this profile and are excited to work on exciting challenges, or would you like to know more about this project, please contact: Prof.dr. Marion K. Matters-Kammerer ([email protected]) or Piyush Kaul ([email protected]).

    For information about employment terms and conditions, please contact HR services ([email protected]).

    Please visit www. tue.nl/jobs and www. tue.nl/en/education/graduate-school/ to learn more about working at TU/e.

    If you want to apply for this position, we invite you to apply by using the “Apply” button.

    Your application must include a,

  • Cover letter describing your motivation and qualifications
  • Detailed curriculum vitae
  • Grade list with a list of courses taken during your Master's study
  • Two references (name, affiliation, and contact information)
  • A scientific report in English, written by yourself (for instance, MSc thesis, internship report, etc.)
  • We are looking forward to your application.

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